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48-6554-18| CONN IC DIP SOCKET ZIF 48POS
48-6554-18
描述 : CONN IC DIP SOCKET ZIF 48POS
品牌 : Aries Electronics
PDF : PDF
庫(kù)存: AVAIL
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屬性
| Contact Finish - Mating | Nickel Boron |
|---|---|
| Contact Finish - Post | Nickel Boron |
| Contact Finish Thickness - Mating | 50μin (1.27μm) |
| Contact Finish Thickness - Post | 50μin (1.27μm) |
| Contact Material - Mating | Beryllium Nickel |
| Contact Material - Post | Beryllium Nickel |
| Features | Closed Frame |
| Housing Material | Polyetheretherketone (PEEK), Glass Filled |
| Mounting Type | Through Hole |
| Number of Positions or Pins (Grid) | 48 (2 x 24) |
| Operating Temperature | -55°C ~ 250°C |
| Pitch - Mating | 0.100" (2.54mm) |
| Pitch - Post | 0.100" (2.54mm) |
| Termination | Solder |
| Type | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing |
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