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屬性
| Contact Finish - Mating | Gold |
|---|---|
| Contact Finish - Post | Tin |
| Contact Finish Thickness - Mating | 29.5μin (0.75μm) |
| Contact Finish Thickness - Post | - |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post | Brass |
| Features | Elevated, Open Frame |
| Housing Material | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
| Mounting Type | Through Hole |
| Number of Positions or Pins (Grid) | 32 (2 x 16) |
| Operating Temperature | -55°C ~ 125°C |
| Pitch - Mating | 0.100" (2.54mm) |
| Pitch - Post | 0.100" (2.54mm) |
| Termination | Solder |
| Type | DIP, 0.4" (10.16mm) Row Spacing |
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