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44-3574-18| CONN IC DIP SOCKET ZIF 44POS TIN
44-3574-18
描述 : CONN IC DIP SOCKET ZIF 44POS TIN
品牌 : Aries Electronics
PDF : PDF
庫(kù)存: AVAIL
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屬性
| Contact Finish - Mating | Tin |
|---|---|
| Contact Finish - Post | Tin |
| Contact Finish Thickness - Mating | 200μin (5.08μm) |
| Contact Finish Thickness - Post | 200μin (5.08μm) |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post | Beryllium Copper |
| Features | Closed Frame |
| Housing Material | Polyphenylene Sulfide (PPS), Glass Filled |
| Mounting Type | Through Hole |
| Number of Positions or Pins (Grid) | 44 (2 x 22) |
| Operating Temperature | - |
| Pitch - Mating | 0.100" (2.54mm) |
| Pitch - Post | 0.100" (2.54mm) |
| Termination | Solder |
| Type | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing |
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