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30-8563-610C| CONN IC DIP SOCKET 30POS GOLD
30-8563-610C
描述 : CONN IC DIP SOCKET 30POS GOLD
品牌 : Aries Electronics
PDF : PDF
庫(kù)存: AVAIL
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屬性
| Contact Finish - Mating | Gold |
|---|---|
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Mating | 30μin (0.76μm) |
| Contact Finish Thickness - Post | 10μin (0.25μm) |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post | Brass |
| Features | Closed Frame, Elevated |
| Housing Material | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Mounting Type | Through Hole |
| Number of Positions or Pins (Grid) | 30 (2 x 15) |
| Operating Temperature | -55°C ~ 105°C |
| Pitch - Mating | 0.100" (2.54mm) |
| Pitch - Post | 0.100" (2.54mm) |
| Termination | Solder |
| Type | DIP, 0.6" (15.24mm) Row Spacing |
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