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在線報價一
屬性
| Contact Finish - Mating | Gold |
|---|---|
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Mating | - |
| Contact Finish Thickness - Post | 30μin (0.76μm) |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post | Beryllium Copper |
| Features | Closed Frame |
| Housing Material | Polyethersulfone (PES), Glass Filled |
| Mounting Type | Through Hole |
| Number of Positions or Pins (Grid) | 28 (2 x 14) |
| Operating Temperature | -55°C ~ 150°C |
| Pitch - Mating | - |
| Pitch - Post | - |
| Termination | Solder |
| Type | SOIC |
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