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BU080Z-178-HT| CONN IC DIP SOCKET 8POS GOLD
BU080Z-178-HT
描述 : CONN IC DIP SOCKET 8POS GOLD
PDF : PDF
庫存: AVAIL
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屬性
| Contact Finish - Mating | Gold |
|---|---|
| Contact Finish - Post | Copper |
| Contact Finish Thickness - Mating | 78.7μin (2.00μm) |
| Contact Finish Thickness - Post | Flash |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post | Brass |
| Features | Open Frame |
| Housing Material | Polybutylene Terephthalate (PBT), Glass Filled |
| Mounting Type | Surface Mount |
| Number of Positions or Pins (Grid) | 8 (2 x 4) |
| Operating Temperature | -55°C ~ 125°C |
| Pitch - Mating | 0.100" (2.54mm) |
| Pitch - Post | 0.100" (2.54mm) |
| Termination | Solder |
| Type | DIP, 0.3" (7.62mm) Row Spacing |
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型號(hào) : MSP430F149IPMR-KAM
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品牌 : STMicroelectronics
型號(hào) : STM32F103C8T6TR
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品牌 : Texas Instruments
型號(hào) : TMS320F2812PGFAG4
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品牌 : Atmel
型號(hào) : ATMEGA328P-AU
